Pai Rui Co., Ltd.: Collaborating with universities on large-capacity power semiconductor projects

Pairee Co., Ltd. announced that on February 11, 2026, it signed a “Project Technology Cooperation Agreement” with a university. The cooperation will focus on the design, simulation analysis, testing and verification, product finalization, driver development, and production and sales promotion in the field of high-capacity power semiconductor devices and supporting power electronic modules. Pairee Co., Ltd. will be responsible for chip design, manufacturing, packaging, and testing, while the university will lead application verification. The agreement takes effect upon signature and seal by the legal representatives or authorized representatives of both parties, with a validity period of three years. It does not involve specific amounts and is not expected to have a significant impact on the company’s operating performance for this year.