Tailong Pharmaceutical plans to issue 400 million yuan of Sci-Tech Innovation Bonds to repay interest-bearing debt

NightAirdropper · 2026-02-27T17:51:16+00:00

Henan Tailong Pharmaceutical will issue up to 400 million yuan in technological innovation bonds in 2026, with a term of 180 days. The funds will be used to repay interest-bearing debt. The bonds are rated AA with a stable outlook and are underwritten primarily by SPD Bank.

NightAirdropper

2026-02-27 17:51:16

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【Dahe CaLiFang News】On February 25th, Henan Tailong Pharmaceutical Co., Ltd. disclosed documents related to the issuance of the 2026 First Phase Scientific and Technological Innovation Bonds.

The total issuance amount for this bond is up to 400 million yuan, with a term of 180 days. The raised funds are intended to be fully used to repay the issuer’s interest-bearing debt “25 Tailong SCP001.” The bond’s interest start date is February 27, 2026, and the redemption date is August 26, 2026. The lead underwriter, bookrunner, and ongoing management agency is Shanghai Pudong Development Bank. According to the Shanghai New Century comprehensive assessment, the issuer’s credit rating is AA with a stable outlook.

【Source: Dahe Net】

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