Recently, Professor Kim Jung-ho of Korea Advanced Institute of Science and Technology, known as the “Father of HBM,” emphasized at the “HBF Research Content and Technology Development Strategy Briefing” that as artificial intelligence’s thinking and reasoning abilities become more important, the shift from text to voice interfaces will inevitably lead to a sharp increase in data requirements. Kim Jung-ho predicts that because HBM itself cannot handle the rapidly increasing demand, the industry will inevitably adopt HBF. Although the current structure involves vertically connecting up to two graphics processing units (GPUs) and attaching HBM beside the GPU to handle operations, in the future, attaching both HBM and HBF simultaneously can eliminate capacity limitations. When the MCC (Memory-Centric Computing) architecture, which organically integrates CPU, GPU, and memory on a single basic chip, is completed, the required HBF capacity will further increase, and from 2038 onwards, the demand for HBF will surpass that of HBM. (Science and Technology Innovation Board Daily)
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"Father of HBM": By 2038, HBF's storage needs will exceed those of HBM
Recently, Professor Kim Jung-ho of Korea Advanced Institute of Science and Technology, known as the “Father of HBM,” emphasized at the “HBF Research Content and Technology Development Strategy Briefing” that as artificial intelligence’s thinking and reasoning abilities become more important, the shift from text to voice interfaces will inevitably lead to a sharp increase in data requirements. Kim Jung-ho predicts that because HBM itself cannot handle the rapidly increasing demand, the industry will inevitably adopt HBF. Although the current structure involves vertically connecting up to two graphics processing units (GPUs) and attaching HBM beside the GPU to handle operations, in the future, attaching both HBM and HBF simultaneously can eliminate capacity limitations. When the MCC (Memory-Centric Computing) architecture, which organically integrates CPU, GPU, and memory on a single basic chip, is completed, the required HBF capacity will further increase, and from 2038 onwards, the demand for HBF will surpass that of HBM. (Science and Technology Innovation Board Daily)