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天成半导体成功研制14英寸碳化硅单晶材料
人民财讯3月29日电,据太原日报消息,近日,中北高新区企业天成半导体继12英寸双突破后,依托自主研发设备成功研制出14英寸碳化硅单晶材料,有效厚度达30毫米。14英寸碳化硅单晶材料主要应用于碳化硅部件,即以碳化硅及其复合材料为主要材料的设备零部件。